The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is … Mehr…
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated.These Conferences on thermal conductivity grew out of the needs of researchers in the field.The Conferences were held annu- ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences.These Conferences provide a broadly based forum for researchers actively working on the thermal conduc- tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results.The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub- licity and continuing funding support, when they see something worthwhile going on.It is believed that this series of Conferences not only will grow stronger, but will set an example for research- ers in other fields on how to jointly attack their own problem areas.; PDF; Scientific, Technical and Medical > Mechanical engineering & materials > Materials science, Springer US<
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The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is … Mehr…
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated.These Conferences on thermal conductivity grew out of the needs of researchers in the field.The Conferences were held annu- ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences.These Conferences provide a broadly based forum for researchers actively working on the thermal conduc- tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results.The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub- licity and continuing funding support, when they see something worthwhile going on.It is believed that this series of Conferences not only will grow stronger, but will set an example for research- ers in other fields on how to jointly attack their own problem areas.; PDF; Scientific, Technical and Medical > Mechanical engineering & materials > Materials science, Springer US<
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Thermal Conductivity 18 ab 96.49 € als pdf eBook: . Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, Medien > Bücher nein eBook als pdf eBooks > Sachthemen & Ratgeber > Technik, S… Mehr…
Thermal Conductivity 18 ab 96.49 € als pdf eBook: . Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, Medien > Bücher nein eBook als pdf eBooks > Sachthemen & Ratgeber > Technik, Springer US<
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The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is … Mehr…
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated.These Conferences on thermal conductivity grew out of the needs of researchers in the field.The Conferences were held annu- ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences.These Conferences provide a broadly based forum for researchers actively working on the thermal conduc- tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results.The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub- licity and continuing funding support, when they see something worthwhile going on.It is believed that this series of Conferences not only will grow stronger, but will set an example for research- ers in other fields on how to jointly attack their own problem areas.; PDF; Scientific, Technical and Medical > Mechanical engineering & materials > Materials science, Springer US<
No. 9781468449167. Versandkosten:Instock, Despatched same working day before 3pm, zzgl. Versandkosten.
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is … Mehr…
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated.These Conferences on thermal conductivity grew out of the needs of researchers in the field.The Conferences were held annu- ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences.These Conferences provide a broadly based forum for researchers actively working on the thermal conduc- tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results.The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub- licity and continuing funding support, when they see something worthwhile going on.It is believed that this series of Conferences not only will grow stronger, but will set an example for research- ers in other fields on how to jointly attack their own problem areas.; PDF; Scientific, Technical and Medical > Mechanical engineering & materials > Materials science, Springer US<
No. 9781468449167. Versandkosten:Instock, Despatched same working day before 3pm, zzgl. Versandkosten.
Thermal Conductivity 18 ab 96.49 € als pdf eBook: . Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, Medien > Bücher nein eBook als pdf eBooks > Sachthemen & Ratgeber > Technik, S… Mehr…
Thermal Conductivity 18 ab 96.49 € als pdf eBook: . Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, Medien > Bücher nein eBook als pdf eBooks > Sachthemen & Ratgeber > Technik, Springer US<
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EAN (ISBN-13): 9781468449167 Erscheinungsjahr: 2012 Herausgeber: Springer US
Buch in der Datenbank seit 2016-06-24T11:44:11+02:00 (Berlin) Detailseite zuletzt geändert am 2023-04-09T09:43:50+02:00 (Berlin) ISBN/EAN: 9781468449167
ISBN - alternative Schreibweisen: 978-1-4684-4916-7 Alternative Schreibweisen und verwandte Suchbegriffe: Autor des Buches: david ashworth, robert green Titel des Buches: thermal conductivity
Daten vom Verlag:
Autor/in: T. Ashworth; David R. Smith Titel: Thermal Conductivity 18 Verlag: Springer; Springer US 764 Seiten Erscheinungsjahr: 2012-12-06 New York; NY; US Sprache: Englisch 53,49 € (DE) 55,00 € (AT) 59,00 CHF (CH) Available XX, 764 p.
EA; E107; eBook; Nonbooks, PBS / Technik/Maschinenbau, Fertigungstechnik; Werkstoffprüfung; Verstehen; alloy; calibration; ceramics; crystal; finite element method; glass; glass transition; glass-ceramic; liquid; metals; modeling; C; Characterization and Analytical Technique; Chemistry and Materials Science; BC
Session A Keynote Address.- Session B Invited Paper.- Session C Theory and Modeling.- Session D Liquids and Gases.- Session E Salts, Oxides, and Binary Compounds.- Session F Data Acquisition Systems.- Session G Metals and Alloys.- Session H Miscellaneous Materials.- Session J Measurement Apparatus.- Session L Invited Papers.- Session M Insulations.- Session N Insulations.- Session P Invited Paper.- Session Q Ceramics.- Session R Pulse Measurement Techniques.- Session S Invited Paper.- Session T Theory and Numerical Analysis.- Session U Composites.- Session V Geological Materials.- Session Y Poster Session.- Author Index.
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